Basler's main attractions at Vision 2022:

 

ace 2 camera with 5GigE technology: In addition to high speed operation, this camera is cost-effective and easy to integrate. Its tried-and-true size design and perfectly compatible software ensure that customers can easily upgrade their vision systems for performance enhancements.
 

pylon vTools: This software module enables customers to quickly and easily add complex, powerful image processing capabilities to their applications. pylon vTools enables users to design, test, and integrate multiple capabilities with flexibility, including intelligent structure recognition, precise object location, or powerful code recognition. Thanks to Basler's adaptable product line, these functions can be combined with camera control and image capture.
 

New SWIR and thermal imaging cameras: SWIR cameras operate on light outside the visible spectrum, enabling simple and cost-effective infrared detection for industrial applications. Example applications include detecting hidden structures in test samples or measuring water and sugar content.
 

200 new Light Source products: These high quality components are designed and tested specifically for industrial applications to ensure easy integration and compatibility with all other Basler components.
 

3D Camera Product line: Basler's industry-proven 3D camera line uses ToF and stereoscopic technology to provide accurate 3D vision for applications.
 

Rene von Fintel, Managing Director of Basler's product Business, said that the Basler booth was a good example of the company's strategic reorientation: "This year, we took another big step towards becoming a full-line visual product provider. These include innovative extensions to the camera line, such as the new ace 2 5GigE camera, Basler Thermal Imaging camera and SWIR camera; As well as new light components and image processing tools in pylon software."

 

Basler will demonstrate product performance in multiple live demonstrations at the booth, including a visually guided robot system to demonstrate pickup and placement, measurement, and bar code reading. The company will also demonstrate its wafer detection system developed in collaboration with NXP® (NXP). Visitors can simulate the use of a vision system with AI and deep learning to detect defects on wafers.